Qualcomm FastConnect 6700
cpe:2.3:h:qualcomm:fastconnect_6700:*:*:*:*:*:*:*, +1 more
- >= 12.1X46, < 12.1X46-D81
A use-after-free vulnerability has been identified in the Bluetooth Host component of various chipsets, including those in the Snapdragon 8 Gen 3 Mobile Platform and FastConnect series. This vulnerability arises from memory corruption while processing IOCTL commands, specifically when the buffer in write loopback mode is accessed after being freed. The issue could potentially be exploited locally, leading to unauthorized memory access or manipulation.
Exploitation of this vulnerability causes memory corruption, which can lead to arbitrary code execution or other unintended behavior by allowing manipulation of memory after it has been freed, creating opportunities for exploitation.
Qualcomm has released patches for this vulnerability. Instructions for applying the patch can be found in the Qualcomm June 2025 Security Bulletin.
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