Qualcomm FastConnect 6900
cpe:2.3:h:qualcomm:fastconnect_6900:*:*:*:*:*:*:*, +1 more
- >= 12.1X46, < 12.1X46-D81
A use-after-free vulnerability has been identified in various chipsets of Qualcomm products, including those in the Automotive Software platform based on QNX, Windows WLAN Host, and several chipsets used in mobile and automotive applications. This vulnerability allows memory corruption by improperly managing DMA buffers during IOCTL operations, which could potentially be exploited to cause unauthorized memory access or manipulation.
Exploitation of this vulnerability leads to memory corruption, which can cause undefined behavior in the application, including potential arbitrary code execution or causing the system to crash.
Qualcomm has released patches for this vulnerability. Instructions for applying the patch can be found in the January 2025 Qualcomm Security Bulletin.
Our algorithm analyzes dozens of metrics to generate these 8 key vulnerability categories, which are then combined to calculate the overall risk score.