Qualcomm FastConnect 6700
cpe:2.3:h:qualcomm:fastconnect_6700:*:*:*:*:*:*:*, +1 more
A buffer overflow vulnerability has been identified in various chipsets of Qualcomm products, including those in the Snapdragon 8 Gen 3 Mobile Platform and several Windows WLAN Host chipsets. This vulnerability allows for memory corruption by processing IPA statistics when no active clients are registered, potentially leading to unauthorized memory access or manipulation.
Exploitation of this vulnerability causes memory corruption, which can lead to arbitrary code execution or other unintended behavior by allowing manipulation of the program's memory.
Qualcomm has released patches for this vulnerability. Instructions for applying the patch can be found in the January 2025 Qualcomm Security Bulletin.
Our algorithm analyzes dozens of metrics to generate these 8 key vulnerability categories, which are then combined to calculate the overall risk score.